The?TSZ151?op amps have very low?offset voltage with minimal temperature?drift, offering high accuracy and stability?to circuits for sensor interfacing, signal?conditioning, and current measurement.
The?STPMIC25?power-management IC for STM32MP2 microprocessors is now available, with 16 channels to supply all the MPU power rails as well as system peripherals in one convenient package. Completing the hardware design requires only a small number of external components to provide filtering and stabilization and the STEVAL-PMIC25V1 evaluation board is available now to start development immediately.
TS3121?and?TS3121A?rail-to-rail, open-drain, single channel comparators feature a novel failsafe architecture and guaranteed start-up time that simplify powering up for short periods to minimize consumption in low-power applications.?Ideal for use in industrial controls, building automation, power tools, smart metering, as well as in automotive powertrain and body-control modules.
ST’s?DCP3601?miniature monolithic buck converter combines extensive feature integration and flexibility, enabling simple, low-BOM designs to achieve high conversion efficiency. The power switches and compensation are built-in, requiring only six components to complete the circuit, including the inductor, bootstrap and filter capacitors, and feedback resistors for setting the output voltage.
STMicroelectronics’?TSC1801?low-side current-measurement amplifier integrates matched resistors to set the gain, which simplifies the circuit design, saves bill-of-materials costs, and ensures gain accuracy within 0.15% over the entire temperature range. The fixed gain also eliminates production trimming of external resistors.
STPOWER?MDmesh?DM9 AG automotive-grade 600V/650V super-junction MOSFETs?deliver high efficiency and ruggedness for?on-board chargers and DC/DC converters in?both hard- and soft-switching topologies.
Accelerating the design of gallium-nitride (GaN) power supplies (PSUs) that deliver superior efficiency and power density, STMicroelectronics has launched the?EVL250WMG1L?resonant-converter reference design based on the MasterGaN1L System-in-Package (SiP).
ST’s?VIPerGaN65D?flyback converter, with its SOIC16 outline, permits extremely small and economical power supplies, adapters, and USB-PD (Power Delivery) fast chargers up to 65W with universal input voltage.
2025年6月5日，中國——意法半導(dǎo)體宣布Wi-Fi 6和低功耗藍(lán)牙 5.4二合一模塊ST67W611M1正式進(jìn)入量產(chǎn)階段，與此同時，重要客戶Siana采用該模塊的設(shè)計項目已取得初步成功，大大縮短了無線連接解決方案的研發(fā)周期。
2025年5月30日，中國--服務(wù)多重電子應(yīng)用領(lǐng)域、全球排名前列的半導(dǎo)體公司意法半導(dǎo)體(STMicroelectronics，簡稱ST;紐約證券交易所代碼:STM) 參加了 5 月 20 日至 22 日的2025年東南亞半導(dǎo)體展會(展位號 L1901)。
2025年5月29日，中國--服務(wù)多重電子應(yīng)用領(lǐng)域、全球排名前列的半導(dǎo)體公司意法半導(dǎo)體(STMicroelectronics，簡稱ST;紐約證券交易所代碼:STM)日前宣布與新加坡科技研究局微電子研究所 (A*STAR IME) 和愛發(fā)科 (ULVAC) 合作，共同拓展意法半導(dǎo)體在新加坡的“廠內(nèi)實驗室”(LiF)合作項目。新一期項目包括與新加坡科技研究局材料研究與工程研究所 (A*STAR IMRE) 以及新加坡國立大學(xué) (NUS)的合作項目。
2025年5月28日，中國——意法半導(dǎo)體ST4SIM-300嵌入式SIM (eSIM) 已完成GSMA SGP.32 eSIM 物聯(lián)網(wǎng)標(biāo)準(zhǔn)認(rèn)證。該認(rèn)證確保ST4SIM-300能夠與全球蜂窩移動網(wǎng)絡(luò)和物聯(lián)網(wǎng)服務(wù)平臺互操作，并支持用戶遠(yuǎn)程配置網(wǎng)絡(luò)連接和輕松換網(wǎng)。
優(yōu)化設(shè)計的GaN半橋驅(qū)動器
業(yè)內(nèi)首款嵌入AI的雙MEMS加速度計慣性測量單元(IMU)，測量準(zhǔn)確，320g滿量程
意法半導(dǎo)體（ST）成立于1988年6月，由意大利SGS微電子公司和法國Thomson半導(dǎo)體公司合并而成，是半導(dǎo)體工業(yè)最具創(chuàng)新力的公司之一。
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